JPS6320120Y2 - - Google Patents

Info

Publication number
JPS6320120Y2
JPS6320120Y2 JP19512383U JP19512383U JPS6320120Y2 JP S6320120 Y2 JPS6320120 Y2 JP S6320120Y2 JP 19512383 U JP19512383 U JP 19512383U JP 19512383 U JP19512383 U JP 19512383U JP S6320120 Y2 JPS6320120 Y2 JP S6320120Y2
Authority
JP
Japan
Prior art keywords
electronic component
pedestal
mold
molded body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19512383U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103841U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19512383U priority Critical patent/JPS60103841U/ja
Publication of JPS60103841U publication Critical patent/JPS60103841U/ja
Application granted granted Critical
Publication of JPS6320120Y2 publication Critical patent/JPS6320120Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP19512383U 1983-12-19 1983-12-19 電子部品装置 Granted JPS60103841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19512383U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Publications (2)

Publication Number Publication Date
JPS60103841U JPS60103841U (ja) 1985-07-15
JPS6320120Y2 true JPS6320120Y2 (en]) 1988-06-03

Family

ID=30419181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19512383U Granted JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Country Status (1)

Country Link
JP (1) JPS60103841U (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
JP2006120833A (ja) * 2004-10-21 2006-05-11 Harvatek Corp 電気光学半導体のパッケージ構造
JP6392654B2 (ja) * 2014-02-04 2018-09-19 エイブリック株式会社 光センサ装置
JP2017050411A (ja) * 2015-09-02 2017-03-09 株式会社東芝 光半導体装置、およびその製造方法
JPWO2019059047A1 (ja) * 2017-09-20 2020-10-01 岩崎電気株式会社 発光装置、照明装置、及び発光装置の製造方法

Also Published As

Publication number Publication date
JPS60103841U (ja) 1985-07-15

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